Senior Applications Engineer

We Are

Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

You Are

You bring practical experience in semiconductor design with a strong foundation in power integrity, thermal integrity, or timing signoff. You have worked with tools like RedHawk-SC, PrimeTime, or Totem in production environments and understand what it takes to move a chip through signoff successfully.

You are comfortable working directly with customers, including highly technical experienced engineers. You listen well, ask the right questions, and know when to escalate to R&D versus solve the problem with existing capabilities. You can translate customer requirements into clear technical specifications that software teams can act on.

You bring a practical mindset to customer engagements. You understand that technical work must tie to business outcomes, and you balance depth with pragmatism. You are organized, self-directed, and able to manage multiple customer requests without losing track of priorities.

At Synopsys, you will support tier-one accounts on problems that directly affect tape-out schedules, working with a global team that values technical rigor and customer impact.

What You'll Be Doing

• Support key accounts on power integrity, thermal integrity, and signal integrity signoff
• Meet with customers multiple times a day to understand technical requirements, debug complex design issues, and deliver solutions that accelerate their tape-out schedules
• Translate customer needs into clear technical requirements for internal R&D teams, writing specs that bridge the gap between electrical engineering and software development
• 3D-IC power, multiphysics and thermal integrity signoff
• Deploy and validate new workflows and integrated capabilities, including IR-aware timing flows and thermal-aware design methodologies, in live customer environment
• Support both post-sales deployments and pre-sales engagements, helping customers adopt new tools and capabilities while ensuring existing workflows run smoothly
• Build internal expertise on classic Synopsys tools and workflows, contributing to knowledge sharing and cross-training efforts as the team integrates Ansys and Synopsys capabilities
• Work with global engineering teams to align customer feedback with product roadmaps, ensuring that what you learn in the field shapes what gets built next

The Impact You Will Have

• Drive adoption of Synopsys and Ansys signoff tools at tier-one accounts, expanding our footprint in markets that define the future of AI and high-performance computing
• Help customers resolve complex power, thermal, timing, and reliability challenges that directly affect their ability to tape out on schedule
• Influence the evolution of industry-leading EDA products by feeding real customer use cases and technical gaps back to R&D teams
• Strengthen customer relationships by acting as a trusted technical advisor who understands both the tools and the problems they are trying to solve
• Improve internal capability through knowledge sharing, documentation, and cross-training as the team builds expertise across the combined Synopsys and Ansys portfolio

What You'll Need

• Bachelor's degree in Electrical Engineering with at least 2 years of experience, or Master's degree in Electrical Engineering with at least 1 year of experience
• At least 1 year of hands-on experience in semiconductor design with strong expertise in PDN/EMIR, static timing analysis, timing closure, thermal integrity, or ECO flows at block or SoC level
• Hands-on experience with tools such as RedHawk-SC, RedHawk-SC ElectroThermal, Totem, Totem-SC, PrimeTime, or PrimeClosure
• 3D-IC architecture knowledge would be plus such as TSMC CoWoS-L , interposer PDN design awareness
• Strong understanding of signoff flows including power integrity, thermal integrity, timing analysis, and reliability
• Ability to debug and solve complex design issues independently without waiting for perfect information
• Programming or scripting skills in Python, TCL, or similar languages to automate workflows and solve engineering challenges
• Knowledge of advanced node design and semiconductor flows is highly desirable

Who You Are

• You know when a customer request can be solved with existing capabilities and when it requires a new feature, and you can articulate that distinction clearly to both the customer and your R&D team
• You do not need someone to tell you what to work on next. You manage your own queue, prioritize based on customer impact and business value, and keep stakeholders informed without being asked
• You understand that this is a customer-facing role with a sales dimension. You care about whether an engagement leads to adoption, expansion, or revenue, not just whether it was technically interesting
• You are comfortable working across time zones and tools, ramping on new capabilities quickly, and contributing to team knowledge even when it is outside your core area
• You can write a clear technical spec for an R&D team that explains what the customer needs, why it matters, and what success looks like, without losing the nuance in translation

The Team You'll Be Part Of

You will join the application engineering team supporting tier-one accounts, primarily focused on signoff tools including power integrity, thermal integrity, and signal integrity. The team works closely with customers every day on both production support and new capability deployments.

The team is global, but this role will work primarily with North American customers and will be based in Vancouver. You will have access to principal and senior staff-level engineers who can help you ramp, and you will be expected to contribute to building the team's expertise on classic Synopsys tools as the integration continues.